Turnkey Solutions

The ATMPI Engineers provide detailed development, investigation, and analysis of customers’ data and test results. Leveraging the following core skills to deliver value across our collaborators’ programs: 

Advanced Statistical Analysis – ATMPI Datacruncher™ is able to process large amounts of data and tease out correlations and determine the statistical significance of process change and correlations.

Failure Analysis Capabilities – At ATMPI, we go beyond traditional Failure Analysis methods, offering a comprehensive suite of advanced tools and expert engineering to uncover the root causes of complex failures. Our cutting-edge technology allows us to examine deep into the details of your products, ensuring that we provide accurate, actionable insights for improvement. 

Here’s how our Failure Analysis capabilities set us apart:

  Radiographic X-Ray Inspection

  • Identify wire-related defects with precision.
  • Measure die-attached voids for detailed internal assessments.

  Scanning Acoustic Microscopy (SAM)

  • Detect internal cracks and interfacial delamination in non-hermetic products, ensuring structural integrity.

  Advanced Grinding & Polishing Techniques

  • Perform cross-sectional analysis to examine internal planes destructively, revealing hidden flaws.

  Curve Tracer Analysis

  • Verify unit current/voltage characteristics, ensuring components meet standards.

  High-Power & Low-Power Microscopy

  • Conduct visual inspections at both high and low magnifications to uncover defects and anomalies not visible to the naked eye.

  Chemical Preparation & Decapsulation

  • Remove encapsulating materials to expose internal parts, enabling thorough visual inspections.

  Liquid Crystal Hot Spot Detection

  • Pinpoint abnormal heat locations at the die level, crucial for identifying leakage failures.

  Die Test Jig Analysis

  • Evaluate die-level current/voltage characteristics with high precision, using a curve tracer for accuracy.

  Solder Pot Testing

  • Ensure reliability with Solderability and Resistance to Solder Heat tests, critical for long-term performance.

  Environmental Stress Testing

  • Utilize Pressure Cooker Test Chambers, Temperature Cycle Tests, and High-Temperature Storage Life Tests to simulate and analyze real-world environmental conditions.

  Moisture Sensitivity & Reflow Testing

  • Classify moisture sensitivity levels and assess reflow profiles, safeguarding your products from moisture-induced failures.

  Comprehensive Reliability Testing

  • Conduct Lead Fatigue Tests and Unbiased Temperature and Humidity Tests to ensure your products can withstand the rigors of operational environments.

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