The ATMPI provides turnkey solutions for semiconductor devices and components from wafer sort through assembly, parametric testing, and final functional testing Hot, Cold, and Ambient.  Customer view their work in progress (WIP) on our cloud-based WIP.  Our turnkey solutions allow a seamless scale-up option from a few parts to millions of parts per month.

Advanced Statistical Analysis – The DataCruncher™ can process large amounts of data to analyze correlation, statistical significance of process change, and failure analysis.

Failure Analysis Capabilities – We go beyond traditional Failure Analysis methods, offering a comprehensive suite of advanced tools and expert engineering to discover the root causes of complex failures. Our technology allows us to examine deep into the details of products failures.

Here’s how our Failure Analysis capabilities set us apart:

  Radiographic X-Ray Inspection

• Identify wire-related defects with precision.
• Measure die-attached voids for detailed internal assessments.

  Scanning Acoustic Microscopy (SAM)

• Detect internal cracks and interfacial delamination in non-hermetic products, ensuring structural integrity.

  Advanced Grinding & Polishing Techniques

• Perform cross-sectional analysis to examine internal planes destructively, revealing hidden flaws.

  Curve Tracer Analysis

• Verify unit current/voltage characteristics, ensuring components meet standards.

  High-Power & Low-Power Microscopy

• Conduct visual inspections at both high and low magnifications to uncover defects and anomalies not visible to the naked eye.

  Chemical Preparation & Decapsulation

• Remove encapsulating materials to expose internal parts, enabling thorough visual inspections.

  Liquid Crystal Hot Spot Detection

• Pinpoint abnormal heat locations at the die level, crucial for identifying leakage failures.

  Die Test Jig Analysis

• Evaluate die-level current/voltage characteristics with high precision, using a curve tracer for accuracy.

  Solder Pot Testing

• Ensure reliability with Solderability and Resistance to Solder Heat tests, critical for long-term performance.

  Environmental Stress Testing

• Utilize Pressure Cooker Test Chambers, Temperature Cycle Tests, and High-Temperature Storage Life Tests to simulate and analyze real-world environmental conditions.

  Moisture Sensitivity & Reflow Testing

• Classify moisture sensitivity levels and assess reflow profiles, safeguarding your products from moisture-induced failures.

  Comprehensive Reliability Testing

• Conduct Lead Fatigue Tests and Unbiased Temperature and Humidity Tests to ensure your products can withstand the rigors of operational environments.