ATMPI has developed proprietary technology for the highly parallel testing of parts after saw. Our technology fixes the die in position after the sawing processes, with minimal x-y displacement. This allows for highly parallel testing of the die at temperatures ranging from -55°C to 200°C on automated test equipment.

Benefits our customers and collaborators both during their engineering and production phases b:

• Increased throughput (UPH) – Testing at high volume, our technology increases the test yield for chip scale, bumped die, and singulated die on the film frame handler and or prober.  The result is elimination of jams associated with turret and gravity feed handlers and increasing test yield.
• Reduced Tooling Costs – The tooling costs for handling chip scale packages on handlers such as turret and gravity feed handlers are avoided when handling the parts on the film frame handler.
• Reduced Engineering Setup Costs – The engineering time required to implement a change kit on turret and gravity feed handlers is eliminated.
• Tri-Temperature Testing – Film frame handlers strategy supports testing of parts at multiple temperatures ranging from -40°C to 85°C.
• Reduced Test Costs – The increased throughput of testing coupled with lower engineering setup costs and associated NRE results in a lower test cost and higher customer margins.
• Test After Saw – Mechanical and chemical damage to device functionality from the saw process are test rejects when testing after saw.